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AMD Phenom II Triple-Core Mobile P860 - HMP860SGR32GM information
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Type:CPU
Manufacturer:AMD
family:Phenom II Triple-Core Mobile
microprocessors:AMD Phenom II Triple-Core Mobile P860 - HMP860SGR32GM
Type
CPU / Microprocessor
Market segment
Mobile
Family
AMD Phenom II Triple-Core Mobile
Model number
P840
CPU part number
HMP840SGR32GM
is an OEM/tray microprocessor
Stepping code
NADHC AD
Frequency
1900 MHz
Bus speed
One 1800 MHz 16-bit HyperTransport link (3.6 GT/s)
Clock multiplier
9.5
Package
638-pin lidless organic micro Pin Grid Array (UOL638)
AMD Package number
30605
Socket
Socket S1 (S1g4)
Size
1.38" x 1.38" / 3.5cm x 3.5cm
Weight
0.2oz / 6.5g (by specifications)
Introduction date
September - October 2010
End-of-Life date
Last order date is 3rd quarter 2011
Last shipment date is 1st quarter 2012
Architecture / Microarchitecture
Microarchitecture
K10
Platform
Danube
Processor core
Champlain
Core stepping
BL-C3
CPUID
100F53
Manufacturing process
0.045 micron silicon-on-insulator (SOI) technology
Data width
64 bit
The number of cores
3
The number of threads
3
Floating Point Unit
Integrated, 128-bit wide
Level 1 cache size
3 x 64 KB 2-way set associative instruction caches
3 x 64 KB 2-way set associative data caches
Level 2 cache size
3 x 512 KB 16-way set associative caches
Level 3 cache size
None
Multiprocessing
Uniprocessor
Features
MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a
AMD64 / AMD 64-bit technology
EVP / Enhanced Virus Protection
AMD-V / AMD Virtualization technology
Low power features
PowerNow!
Integrated peripherals / components
Integrated graphics
None
Memory controller
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1066, DDR3L-1066
Maximum memory bandwidth (GB/s): 17.1
Other peripherals
HyperTransport technology 3.0
Electrical / Thermal parameters
Thermal Design Power
25 Watt
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